Controller receiving combined TMS/TDI and suppyling separate TMS and TDI

ABSTRACT

An optimized JTAG interface is used to access JTAG Tap Domains within an integrated circuit. The interface requires fewer pins than the conventional JTAG interface and is thus more applicable than conventional JTAG interfaces on an integrated circuit where the availability of pins is limited. The interface may be used for a variety of serial communication operations such as, but not limited to, serial communication related integrated circuit test, emulation, debug, and/or trace operations.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority from Provisional Application No.60/663,953, filed Mar. 21, 2005, and is related to the following patentapplications or patent:

application Ser. No. 11/292,643, “Reduced Signal Interface Method andApparatus”, now U.S. Pat. No. 7,308,629, issued Dec. 11, 2007;application Ser. No. 11/293,061, “Selectable Pin Count JTAG”, now U.S.Pat. No. 7,328,387, issued Feb. 5, 2008; application Ser. No.11/258,315, “2 Pin Bus”, now pending; U.S. Pat. No. 6,073,254“Selectively Accessing IEEE 1149.1 Taps in a Multiple Tap Environment”;and application Ser. No. 11/292,597, “Multiple Test Access PortProtocols Sharing Common Signals”, now pending.

BACKGROUND OF THE DISCLOSURE

This disclosure relates in general to IC signal interfaces and inparticular to IC signal interfaces related to test, emulation, debug,and trace operations.

DESCRIPTION OF THE RELATED ART

FIG. 1 illustrates a conventional 5 wire JTAG interface 106 between anexternal JTAG controller 100 and Tap Domains 104 within a target IC 102.Modern day ICs typically have a Tap Domain associated with the IC's JTAGboundary scan test operations and/or one or more Tap Domains associatedwith each one or more core circuits designed into the IC. The interfacecouples the TDO output of JTAG controller to the IC's TDI pin input, theTMS output of the JTAG controller to the IC's TMS pin input, the TCKoutput of the JTAG controller to the IC's TCK pin input, the TDI inputof the JTAG controller to the IC's TDO pin output, and the TRST outputof the JTAG controller to the IC's TRST pin input. The IC's TDI, TDO,TMS, TCK, and TRST pins 108 are dedicated for interfacing to the JTAGcontroller and cannot be used functionally.

In response to the TMS and TCK signals, the Tap Domains 104 of IC 102communicates data to and from the JTAG controller via the TDO to TDIconnections. A low output on the JTAG controller's TRST output causesthe Tap Domains of IC 102 to enter a reset state. The JTAG controllerreceives a clock input (CKIN) from a clock source 110. The CKIN inputtimes the operation of the JTAG controller, which in turn times theoperation of the Tap Domains in IC 102. The JTAG controller can be usedto perform test, emulation, debug, and trace operations in the target ICby accessing the embedded Tap Domains via the 5 wire interface. Thearrangement between the JTAG controller and the target IC and its use inperforming test, emulation, debug, and trace operations is well known inthe industry.

FIG. 2 illustrates an alternate arrangement whereby a JTAG controller200 is interfaced to a target IC 202 via the JTAG bus 108 and aDebug/Trace bus 204. The JTAG controller 200 differs from the JTAGcontroller of FIG. 1 in that it includes additional circuitry andinput/outputs for interfacing to the IC's Debug/Trace circuitry 204. Asin FIG. 1, the JTAG bus 108 is coupled to Tap Domains 104 within the ICvia IC pins 108. The Debug/Trace bus 204 is coupled to Debug/Tracecircuitry 206 within the IC via N IC pins 208. The JTAG bus is used toinput commands and data that enable the Debug/Trace circuitry to performdebug and/or trace operations. The Debug/Trace bus signals can be usedfor a myriad of operations including but not limited to; (1) importingand/or exporting data between the JTAG controller 200 and Debug/Tracecircuitry 206 during debug and/or trace operations, (2) operating as acommunications bus between the JTAG controller 200 and Debug/Tracecircuitry 206, and (3) inputting and/or outputting trigger signalsbetween the JTAG controller 200 and Debug/Trace circuitry 206 duringdebug and trace operations.

One of the key advantages of the debug/trace bus 204 is that itincreases the data input/output bandwidth between the JTAG controllerand target IC during debug/trace operation over what is possible usingonly the 5 wire JTAG bus 106. For example, the data input/outputbandwidth of the JTAG bus is limited to the amount of data that can flowbetween the JTAG controller and IC over the single TDO to TDI signalwire connections. Since the debug/trace bus can have N signal wireconnections between the JTAG controller and IC (N), its data bandwidthcan be much greater than the JTAG bus bandwidth. Increased databandwidth between the JTAG controller and IC facilitates debug/traceoperations such as; (1) monitoring real time code execution, (2)accessing embedded memories, (3) uploading/downloading code duringprogram debug, and (4) triggered output trace functions.

With the current trend towards smaller IC packaging to allow more ICs tobe placed on smaller assemblies used in mobile applications, such ascell phones and personal digital assistants, the number of IC pins isbeing reduced. It is therefore a benefit of the present disclosure toprovide a reduced pin count interface on ICs for test, emulation, debug,and trace operations, as this will allow more IC pins to be availablefor functional purposes. While it is advantageous to reduce the pincounts of both the JTAG and Debug/Trace buses of FIGS. 1 and 2, thisapplication focuses on reducing the JTAG bus pins of an IC.

In addition to reducing the JTAG bus pins of an IC, a second benefit ofthe present disclosure is to maintain a high communication bandwidthover the reduced JTAG pins. As will be shown, the present disclosureprovides a data communication bandwidth using the reduced JTAG pins thatis equal to one half the data communication bandwidth using a full setof JTAG pins. For example, if the JTAG controller 100 can communicatedata to and from Tap Domains 104 of FIG. 1 at 100 Mhz using the fullJTAG bus 106, a JTAG controller adapted according to the presentdisclosure can communicate data to and from Tap Domains 104 of an IC,also adapted according to the present disclosure at 50 Mhz.

One prior art technique, referenced herein, is called the J-Link System.The J-Link system provides a way to reduce the JTAG pins of an IC fromthe standard five pins to a reduced set of one or two pins. In a chartshown in the J-Link reference, it is seen that the J-Link interfaceprovides a data communication bandwidth that is one sixth that of theconventional JTAG 5 pin interface. For example and as stated in theJ-Link reference, if the standard 5 pin JTAG interface can operate at 48Mhz, the J-Link interface operates at one sixth of the 48 Mhz frequency,or at 8 Mhz. In comparison and as will be shown herein, if the standard5 pin JTAG interface can operate at 48 Mhz, the reduce pin approach ofthe present disclosure can operate at one half the 48 Mhz frequency, ofat 24 Mhz. Thus the present disclosure provides a three timesimprovement in operating frequency over the referenced J-Link approach.The present disclosure is therefore capable of performing operationsrelated to IC test, debug, emulation, and trace at three times thebandwidth of the referenced J-Link approach.

SUMMARY OF THE DISCLOSURE

The present disclosure provides a reduced pin interface for JTAG basedtest, emulation, debug, and trace transactions between a JTAG controllerand a target IC.

DESCRIPTION OF THE VIEWS OF THE DRAWINGS

FIG. 1 illustrates a conventional 5 signal interface between a JTAGcontroller and target IC.

FIG. 2 illustrates a conventional JTAG controller interfaced to a targetIC via a 5 signal JTAG bus and an N signal Debug/Trace bus.

FIG. 3 illustrates a JTAG controller interfaced to a target IC via a 2signal JTAG bus according to the present disclosure.

FIGS. 4A-4C illustrate various conventional Tap Domain arrangementswithin a target IC.

FIG. 5A illustrates a circuit example of the parallel to serialcontroller (PSC) circuit of the present disclosure.

FIG. 5B illustrates a timing diagram of the operation of the PSC circuitof FIG. 5A.

FIG. 6A illustrates a circuit example of the controller within the PSCcircuit of FIG. 5A.

FIG. 6B illustrates a timing diagram of the operation of the controllerof FIG. 6A.

FIG. 7A illustrates a circuit example of the serial to parallelcontroller (SPC) circuit of the present disclosure.

FIG. 7B illustrates a timing diagram of the operation of the SPC circuitof FIG. 7A.

FIG. 8A illustrates a circuit example of the controller within the SPCcircuit of FIG. 7A.

FIG. 8B illustrates a timing diagram of the operation of the controllerof FIG. 8A.

FIG. 9A illustrates a circuit example of the master reset andsynchronizer (MRS) circuit within the SPC circuit of FIG. 7A.

FIG. 9B illustrates a state diagram of the operation of the MRS circuitof FIG. 9A.

FIG. 9C illustrates a timing diagram of the operation of the MRS circuitof FIG. 9A.

FIG. 10 illustrates the state diagram of the IEEE standard 1149.1 Tapcontroller state machine.

FIG. 11A illustrates a circuit example of the input/output (I/O)circuits within the PSC and SPC circuits.

FIG. 11B illustrates the signaling cases for the I/O circuits of FIG.11A.

FIG. 12 illustrates each signaling case of FIG. 11B in more detail.

FIG. 13A illustrates an example circuit for determining the appropriateTDI or IN signal output of the I/O circuits of FIG. 11.

FIG. 13B illustrates the truth table used for determining theappropriate TDI or IN signal output based on the voltage level of thedata I/O (DIO) signal.

FIG. 14A illustrates the 2 signal connection between the PSC of the JTAGcontroller and the SPC of the target IC according to the presentdisclosure.

FIG. 14B illustrates a timing diagram of the operation of the PSC andSPC circuits of FIG. 14A performing JTAG transactions between the JTAGcontroller and the Tap Domains of the target IC.

FIG. 14C illustrates a timing diagram of the operation of the PSC andSPC circuits of FIG. 14A performing a single bit data register scanbetween the JTAG controller and the Tap Domains of the target IC.

FIG. 15 illustrates a Texas Instruments SN74ACT8990 JTAG bus controllerchip operating to compensate for cable delays.

FIG. 16 illustrates a 2 pin realization of the present disclosurewhereby the CLK signal is driven by a clock source within the JTAGcontroller.

FIG. 17 illustrates a 2 pin realization of the present disclosurewhereby the CLK signal is driven by an internal clock source of thetarget IC.

FIG. 18 illustrates a 1 pin realization of the present disclosurewhereby the CLK signal is driven by an external clock source thatfunctionally inputs to the target IC.

FIG. 19 illustrates a 1 pin realization of the present disclosurewhereby the CLK signal is driven by an internal clock source of thetarget IC that functionally outputs from the IC.

FIG. 20 illustrates a 2 pin realization of the present disclosurewhereby the CLK signal is driven by an clock source external of the JTAGcontroller and target IC.

FIG. 21A illustrates an alternate circuit example of the parallel toserial controller (PSC) circuit of the present disclosure.

FIG. 21B illustrates a timing diagram of the operation of the alternatePSC circuit of FIG. 5A.

FIG. 22A illustrates an alternate circuit example of the serial toparallel controller (SPC) circuit of the present disclosure.

FIG. 22B illustrates a timing diagram of the operation of the SPCcircuit of FIG. 7A.

FIG. 23A illustrates the 3 signal connection between the FIG. 21Aalternate PSC of the JTAG controller and the FIG. 22A alternate SPC ofthe target IC of according to the present disclosure.

FIG. 23B illustrates a timing diagram of the operation of the alternateFIG. 21A PSC and FIG. 22A SPC circuits performing JTAG transactionsbetween the JTAG controller and the Tap Domains of the target IC.

FIG. 24 illustrates a 3 pin realization of the alternate version of thepresent disclosure whereby the CLK signal is driven by a clock sourcewithin the JTAG controller.

FIG. 25 illustrates a 3 pin realization of the alternate version of thepresent disclosure whereby the CLK signal is driven by an internal clocksource of the target IC.

FIG. 26 illustrates a 2 pin realization of the alternate version of thepresent disclosure whereby the CLK signal is driven by an external clocksource that functionally inputs to the target IC.

FIG. 27 illustrates a 2 pin realization of the alternate version of thepresent disclosure whereby the CLK signal is driven by an internal clocksource of the target IC that functionally outputs from the IC.

FIG. 28 illustrates a 3 pin realization of the alternate version of thepresent disclosure whereby the CLK signal is driven by an clock sourceexternal of the JTAG controller and target IC.

DETAILED DESCRIPTION

FIG. 3 illustrates the approach of the present disclosure to reduce thenumber of JTAG pins on an IC 300 and the number of JTAG bus signalconnections between the IC 300 and JTAG controller 100. IC 300 andothers illustrated in this disclosure could represent any type ofintegrated circuit including but not limited to, a microcontroller IC, amicroprocessor IC, a digital signal processor IC, a mixed signal IC, anFPGA/CPLD IC, an ASIC, a system on chip IC, a peripheral IC, a ROMmemory IC, or a RAM memory IC. In FIG. 3, the JTAG controller 100 isinterfaced to a Parallel to Serial Controller (PSC) circuit 302 via TDO,TMS, CKIN, TDI, and TRST signals. The PSC 302 may be a separate circuitfrom the JTAG controller 100 or the PSC 302 and JTAG controller 100 maybe integrated to form a new JTAG controller 304. The PSC 302 isinterfaced to a Serial to Parallel Controller (SPC) circuit 306 in IC300 via a bus comprising a data I/O (DIO) signal 308 and a clock (CLK)signal 310. The SPC 306 is interfaced to Tap Domains 104 in the IC 300via TDI, TMS, TCK, TDO, and TRST signals. As will be described later inregard to FIGS. 16-20, the CLK signal 310 may be driven by a clocksource associated with the JTAG controller 100, a clock sourceassociated with the IC 300, or a clock source not associated with theJTAG controller 100 or IC 300.

FIG. 4A illustrates that the Tap Domain block 104 of IC 300 may consistof a single 1149.1 Tap architecture.

FIG. 4B illustrates that the Tap Domain block 104 of IC 300 may consistof a series of daisy-chained Tap architectures 1-N.

FIG. 4C illustrates that the Tap Domain block 104 of IC 300 may consistof a group of Tap architectures 1-N that may be selected individually orlinked serially together in various daisy-chain arrangements usinglinking circuitry 400. An example of such linking circuitry 400 has beendescribed in referenced U.S. Pat. No. 6,073,254.

FIG. 5A illustrates the PSC circuit 302 in more detail. The PSC consistsof a controller 500, a parallel input serial output (PISO) register 502,and an input/output (I/O) circuit 504. PISO 502 inputs parallel TMS andTDO signals from the JTAG controller 100, the TRST signal from the JTAGcontroller 100, a load (LD) signal from controller 500, and outputs aserial output (OUT) signal to I/O circuit 504.

A simplified view of PISO 502 shows it containing two serially connectedFFs 503 and 505. While the TRST signal from the JTAG controller is low,FFS 503 and 505 are asynchronously set to logic ones and do not respondto the CLK or LD inputs. This can be achieved, for example, byconnecting the TRST signal to the Set input of FFs 503 and 505. The OUTsignal is therefore high while TRST is low. When TRST goes high FFS 503and 505 are enabled to respond to the CLK and LD inputs. In response tothe LD input, FFs 503 and 505 asynchronously load TMS and TDO outputfrom the JTAG controller, respectively. Once loaded, the FFs are shiftedby CLK 310 to output TMS then TDO signals to I/O circuit 504 via the OUTsignal.

Controller 500 inputs the CLK signal 310, the TRST signal from the JTAGcontroller 100. Controller 500 outputs the asynchronous LD signal to thePISO and a clock signal to the CKIN input of JTAG controller 100. WhileTRST is low, the controller is reset and does not respond to the CLKinput. While reset the LD and CKIN outputs from the controller are low.When TRST goes high, the controller is enabled to respond to the CLKinput and output LD and CKIN output signals.

I/O circuit 504 inputs the OUT signals from the PISO and outputs them onDIO 308. The I/O circuit 504 also inputs signals from DIO 308 andoutputs them to the TDI input of JTAG controller 100. I/O circuit 504 isdesigned to allow the output of OUT signals to DIO 308 and the input ofTDI signals from DIO 308 to occur simultaneously. The simultaneous inputand output operation of I/O circuit 504 will be described in detaillater in regard to FIGS. 11A, 11B, 12, 13A, and 13B.

The operation of PSC 302 (while TRST is high) is illustrated in thetiming diagram of FIG. 5B. In response to the CLK input 310, thecontroller 500 operates to periodically output the LD signal to PISO 502and the CKIN signal to JTAG controller 100. Also the CLK input 310 timesthe PISO 502 to shift data from its OUT output to the I/O circuit 504.The I/O circuit passes the OUT signal to the DIO 308 signal. The CKINsignal times the operation of the JTAG controller 100. The LD signalcauses the PISO to asynchronously load the TMS and TDO signal patternfrom JTAG controller 100. Once loaded, the TMS and TDO pattern isshifted out of the PISO to the I/O circuit in response to the CLKsignal.

The following describes the PSC's repeating load and shift out sequence.A TMS and TDO pattern 510 is asynchronously loaded into the PISO inresponse to LD signal 512. CLK signal 514 shifts out the TMS signalportion of pattern 510 on the OUT output of the PISO, then CLK signal516 shifts out the TDO signal portion of pattern 510 on the OUT outputof the PISO. CKIN signal 518 advances the JTAG controller to output thenext TMS and TDO pattern 520. LD signal 522 asynchronously loads thenext TMS and TDO pattern 520 into the PISO. CLK signal 524 shifts outthe TMS signal portion of pattern 520 on the OUT output of the PISO,then CLK signal 526 shifts out the TDO signal portion of pattern 520 onthe OUT output of the PISO. CKIN signal 528 advances the JTAG controllerto output the next TMS and TDO pattern 530 which is asynchronouslyloaded into the PISO by LD signal 532 and shifted out by CLK signals 534and 536. The JTAG controller is advanced to output the next TMS and TDOpattern 540 during CKIN 538. The above described pattern load, patternshift, and JTAG controller advancement process repeats as long as theCLK input 310 is active.

When the JTAG controller 100 receives a CKIN input it will output a newTMS and TDO signal pattern to PISO 502 and input the TDI signal from I/Ocircuit 504. The TMS signal output will control the Tap state machine ofthe target IC's Tap Domain 104 according to FIG. 10, the TDO signal willprovide the TDI input signal to the target IC's Tap Domain (if in theShift-DR/IR state), and the TDI input signal will input data to the JTAGcontroller from the target IC's Tap Domain (if in the Shift-DR/IRstate).

FIG. 6A illustrates an example implementation of controller 500.Controller 500 consists of FF 600, FF 602, AND gates 604-608, and delayinverter 610. While the TRST input from the JTAG controller 100 is low,FFs 600 and 602 are reset and the LD and CKIN outputs are low. When TRSTgoes high, FFs 600 and 602 are enabled to respond to the CLK input 310.FF 600 toggles its load enable (LDENA) output during each rising edge ofCLK input 310. FF 602 stores the LDENA output of FF 600 at its clockenable (CKENA) output on each falling edge of CLK input 310. AND gate604 outputs a high when LDENA is high and CLK is low. AND Gate 606 anddelay inverter 620 operate together to produce a high going pulse on theLD output whenever the output of AND gate 604 goes high.

The duration of the high going pulse on the LD signal is determined bythe input to output signal delay through delay inverter 610. Theduration of the LD pulse should be long enough to asynchronously loadthe PISO with the TMS and TDO pattern but not long enough to interferewith the shifting operation of the PISO. For example, the high going LDpulse should return low for a sufficient amount of time prior to thenext rising edge of the shifting CLK input so as to not interfere withthe shift operation. The CKENA output of FF 602 enables AND gate 608 topass the CLK signal 310 to the CKIN output. CKENA changes state on thefalling edge of CLK 310 to allow a AND gate 608 to be enabled prior tothe rising edge of CLK 310 to allow for good clock gating operation atthe CKIN output.

The operation of controller 500 is illustrated in the timing diagram ofFIG. 6B. In response to the CLK input 310, the controller 500 operatesto periodically output the LD and CKIN signals. As mentioned, the CKINsignal times the operation of the JTAG controller 100 and the LD signalcauses the PISO to asynchronously load the TMS and TDO pattern from theJTAG controller 100. On each rising edge of CLK 310 the LDENA output ofFF 600 toggles its state. On each falling edge of CLK 310 the CKENAoutput of FF 602 is set to the state of the LDENA input to FF 602. A LDpulse output occurs each time LDENA is high and the CLK goes low. A CKINoutput occurs each time CKENA is high and the CLK is high.

FIG. 7A illustrates the SPC circuit 306 in more detail. The PSC consistsof a controller 700, a serial input parallel output (SIPO) register 702,update register 704, Tap state machine (TSM) 706, master reset andsynchronizer (MRS) circuit 708, input/output (I/O) circuit 710, andpower on reset circuit (POR) 712.

POR circuit 712 produces a temporary low active power on reset pulsewhenever the target IC is first power up. This power on reset pulse isused to initialize the MRS circuit. When initialized, the MRS circuit708 outputs a low on the master reset (MRST) signal to initialize othercircuitry within the SPC 306 and to set TRST input of the connected TapDomains 104 low. When TRST is low, the Tap Domains 104 are forced to theTest Logic Reset state. The Test Logic Reset state is a state of the1149.1 Tap state machine and is shown in the Tap state machine diagramof FIG. 10. The POR circuit 712 may exist in the SPC 306 as shown or itmay exist external to the SPC, i.e. as a separate circuit within thetarget IC. The function of the POR circuit to initialize the MRS circuit708 may be achieved by other means. For example a reset pin of the ICmay be substituted for the POR circuit 712 and used to initialize theMRS circuit 708.

Controller 700 inputs the CLK signal 310, a controller enable (CENA)signal from MRS 708, a reset (RST) signal from TSM 706. The controlleroutputs an update clock (UCK) to update register 704 and a TCK signal toTap Domains 104 and TSM 706. A detail description of controller 700 willbe given in FIGS. 8A and 8B.

I/O circuit 710 inputs an output enable (OE) signal from TSM 706. The OEsignal is used to enabled or disable the output drive of I/O circuit710. I/O circuit 710 inputs signals from DIO 308 and outputs them toSIPO 702 via the IN signal. If the OE is set to enable the output driveof I/O circuit 710, TDO signals input from Tap Domains 104 are output onDIO. If the OE is set to disable the output drive of I/O circuit 710,TDO signals are not output on DIO and the I/O circuit operates to onlyinput DIO signals to SIPO 702 via the IN signal. I/O circuit 504 isdesigned to allow the output of TDO signals to DIO 308, if enabled byOE, and the input of IN signals from DIO 308 to occur simultaneously.The simultaneous input and output operation of I/O circuit 710 will bedescribed in detail later in regard to FIGS. 11A, 11B, 12, 13A, and 13B.

SIPO 702 inputs the serialized TMS and TDO signal patterns from the INoutput of I/O circuit 710 in response to the CLK input 310 and outputsthem to update register 704. The update register 704 inputs the TDO andTMS outputs from the SIPO and outputs them as TDI and TMS signals to TapDomains 104. The update register also inputs the MRST signal from theMRS circuit 708. While the MRST signal is active low the TDO and TMSoutputs of the update register 704 are set high. While the MRST signalis inactive high the update register can respond to the update clock(UCK) signal from controller 700 to load TDO and TMS signals from theSIPO 702.

A more detail view of SIPO 702 and update register 704 shows the SIPOcontaining two serially connected FFs 703 and 705. In response to theCLK signal 310, FFs 703 and 705 shift in the serialized TMS and TDOsignals from the IN output of I/O circuit 710. Once the TMS and TDOsignals are shifted in they are transferred in parallel to FFs 707 and709 in the update register 704 in response to the UCK signal where theyare input to the TDI and TMS inputs of Tap Domains 104. The updateregister serves to provide the current TDI and TMS input pattern to theTap Domains 104 while the SIPO operates to serially input the next TDOand TMS pattern to be input to the Tap Domains 104. As mentioned, theoutputs of FFs 707 and 709 are asynchronously forced high in response toa low on the MRS signal, which results in highs being input to the TDIand TMS inputs of Tap Domain 104. This can be achieved, for example, byconnecting the MRS signal to the Set input of FFs 707 and 709.

TSM circuit 706 inputs the TMS output from the update register, the TCKoutput of controller 700, and the MRST output from MRS circuit 708. TSMcircuit 706 outputs a reset (RST) signal to controller 700 and MRScircuit 708, and the OE signal to I/O circuit 710. The TSM is simply theTap state machine defined in IEEE standard 1149.1. The MRST input fromMRS circuit 708 is connected to the standard “TRST” input of 1149.1 TSM,the TCK input from controller 700 is connected to the standard “TCK”input of the 1149.1 TSM, the TMS input from controller 700 is connectedto the standard “TMS” input of the 1149.1 TSM, the RST output from TSMis connected to the standard “Reset*” output of the 1149.1 TSM, and theOE output of the TSM is connected to the standard “Enable” output of the1149.1 TSM.

The TSM circuit is used by the present disclosure to allow the SPC totrack the Tap states of the connected Tap Domains, especially the statesthat control the OE and RST outputs. The operation of the 1149.1 Tapstate machine is defined in the 16 states shown in FIG. 10. While it ispossible to actually use signals from the Tap state machine(s) of theconnected Tap Domains 104 for tracking, instead of implementing adedicated TSM circuit 706 in the SPC 306, the required signals (OE andRST) may not always be available from the Tap Domains 104. For example,connected Tap Domains 104 of hard cores (i.e. cores that are fixed andcannot be modified) may not provide OE and RST output signal terminalsfor connection to the SPC's OE and RST terminals. Further, Tap Domains104 having linking arrangements as shown in FIG. 4C may present OE andRST signal switching complexities between the SPC 306 and linked Tapswithin Tap Domains 104. Therefore, the SPC 306 preferably includes a TSMcircuit 706 to insure simplicity in tracking the states of connected TapDomains 104.

MRS circuit 708 inputs the IN output of I/O circuit 710, the CLK signal310, the RST signal from TSM 706, and the power on reset output of PORcircuit 712. MRS circuit 708 outputs the MRST signal to Tap Domains 104,TSM 706, and update register 704 and the CENA signal to controller 700.The purposes of the MRS circuit 708 are; (1) to maintain the SPC andconnected Tap Domains 104 in a reset state when the target IC isoperating normally in a system with no JTAG controller 100 and PSC 302connected to the SPC's DIO 308 and CLK 310 signals, and (2) to allowsynchronizing the operation of the SPC 306 to the operation of a JTAGcontroller 100 and PSC 302 when the JTAG controller and PSC areconnected to the SPC's DIO and CLK signals. Synchronizing the operationof the SPC to the operation of the JTAG controller and PSC is importantsince it allows the serialized TMS and TDO patterns output from PSC tobe correctly input as serialized TMS and TDO patterns to the SPC. Adetail description of MRS circuit 708 will be given in regard to FIGS.9A-9C.

The operation of SPC 306 is illustrated in the timing diagram of FIG.7B. In response to the CLK input 310, the controller 700 operates toperiodically output the UCK signal to the update register 704 and theTCK signal to Tap Domains 104 and TSM 706. Also the CLK input 310 timesthe SIPO 702 to shift in data from the IN output of the I/O circuit 710.The I/O circuit passes DIO input signals to the IN output. The TCKsignal times the operation of the Tap Domains 104. The UCK signal causesthe update register 704 to load the parallel TDO and TMS signal patternoutput of the SIPO 702. Once loaded, the TDO and TMS signal pattern isapplied to the TDI and TMS inputs of Tap Domains 104. The Tap Domains104 respond to the TDI and TMS signal pattern in response to the TCK.

The following describes the SPC's repeating shift in and updatesequence. A serial TMS and TDO bit stream 718 is shifted into SIPO 702in response to CLK signals 720 and 722. The shifted in TMS and TDOsignals form a parallel TDO and TMS output pattern 724 from SIPO 702that is clocked into to the update register 704 in response to UCKsignal 726. The TDO and TMS pattern 724 in the update register 704 isapplied to the TDI and TMS inputs of Tap Domains 104. TCK signal 728clocks the Tap Domains 104 to respond to the TDI and TMS pattern 724from update register 704. The next serial TMS and TDO bit stream 730 isshifted into SIPO 702 in response to CLK signals 732 and 734. Theshifted in TMS and TDO signals form a parallel TDO and TMS outputpattern 736 from SIPO 702 that is clocked into to the update register704 in response to UCK signal 738. The TDO and TMS pattern 738 in theupdate register 704 is applied to the TDI and TMS inputs of Tap Domains104. TCK signal 740 clocks the Tap Domains 104 to respond to the TDI andTMS pattern 730 from update register 704. The above described serialpattern shift in, parallel pattern update, and Tap Domain clockoperation repeats as long as the CLK input 310 is active.

When the Tap Domain 104 receives a TCK input, the Tap state machine ofthe Tap Domain responds to the TMS input to perform state transitions asseen in FIG. 10. Also the Tap Domain 104 will input data from its TDIinput and output data on its TDO output in response to a TCK input, ifthe Tap state machine is in the Shift-DR/IR state of FIG. 10.

FIG. 8A illustrates an example implementation of controller 700.Controller 700 consists of FF 800, FF 802, AND gates 804 and 806, and ORgate 808. FF 800 toggles its update enable (UPENA) output during eachrising edge of CLK 310. FF 802 stores the UPENA output of FF 800 at itsclock enable (CKENA) output on each falling edge of CLK 310. AND gate804 outputs a high on its UCK output when UPENA is high, CLK is low, andthe controller reset (CRST) output of OR gate 808 is high. AND gate 806is gated on to pass its CLK 310 input to its TCK output whenever CKENAand CRST are high, otherwise the TCK output is forced low. OR gate 808outputs a high on CRST whenever the CENA input from CS circuit 708 ishigh and/or the RST input from TSM 706 is high, otherwise CRST outputs alow. CKENA changes state on the falling edge of CLK 310 to allow ANDgate 806 to be enabled prior to the rising edge of CLK 310 to allow forgood clock gating operation at the TCK output.

The operation of controller 700 is illustrated in the timing diagram ofFIG. 8B. While the CRST output of OR gate 808 is high, the controller700 operates to periodically output the UCK and TCK signals in responseto the CLK input 310. As mentioned, the TCK signal times the operationof the Tap Domains 104 and the UCK signal causes the update register toload the parallel TDO and TMS pattern from SIPO 702. On each rising edgeof CLK 310 the update enable (UPENA) output of FF 800 toggles its state.On each falling edge of CLK 310 the CKENA output of FF 802 is set to thestate of the UPENA input to FF 802. An UCK output occurs each time LDENAis high and the CLK goes low. A CKIN output occurs each time CKENA ishigh and the CLK is high. If CENA and RST are both low, the CRST outputof OR gate 808 will be low to reset controller 700. While CRST is low,the UPENA output of FF 800 is set high, the CKENA output of FF 802 isset low, the UCK output of AND gate 804 is set low, and the TCK outputof AND gate 806 is set low.

FIG. 9A illustrates an example implementation of the MRS circuit 708.MRS circuit 708 consists of a state machine 900 and a FF 902. The statemachine 900 operates on the rising edge of CLK 310 and FF 902 operateson the falling edge of CLK 310. The state machine 900 inputs the INsignal from I/O circuit 710, the RST signal from TSM 706, a clock signalfrom CLK 310, and a power on reset signal from POR 712. The statemachine 900 outputs the previously mentioned MRST signal and acontroller enable (CE) signal. The CE signal is connected to the D inputof FF 902. The Q output of FF 902 drives the previously mentioned CENAsignal. The reset input of the FF 902 is connected to the power on resetoutput of POR 712.

As previously mentioned the purposes of the MRS circuit 708 are tomaintain the SPC and Tap Domains in a reset condition when the SPC's DIO308 signal is not externally driven and to synchronize the operation ofthe SPC with an external circuit driving the SPC's DIO 308 signal.

The operation of state machine 900 is shown in the state diagram of FIG.9B. In response to a low active power on reset input from POR 712 or inresponse to the RST output of TSM 706 going low, the state machine 900will enter “Set MRST Low & Poll IN” state 904. In state 904 the statemachine will output a low on the MRST output signal. The state machinewill remain in state 904 while the IN input from I/O circuit 710 ishigh. The state machine will transition to “Poll IN” state 906 if the INinput goes low. The MRST output remains low in state 906. The statemachine will return to state 904 from state 906 if the IN input goeshigh, otherwise the state machine will transition from state 906 to“Poll IN” state 908. The MRST output remains low in state 908. The statemachine will return to state 904 from state 908 if the IN input goeslow, otherwise the state machine will transition from state 908 to “PollIN” state 910. The MRST output remains low in state 910. The statemachine will return to state 904 from state 910 if the IN input goeslow, otherwise the state machine will transition from state 910 to “SetMRST & CE High” state 912.

In state 912, the state machine sets the MRST and CE signals high. Onthe falling edge of CLK 310, FF 902 clocks in the high CE output fromstate machine 900 which sets the CENA output of FF 902 high. The statemachine will remain in state 912 while the RST input is low. When theRST input goes high, the state machine will transition to the “Set CELow” state 914. In state 914, the state machine sets the CE signal low.On the falling edge of CLK 310, FF 902 clocks in the low CE output fromstate machine 900 which sets the CENA output of FF 902 low. The statemachine will remain in state 914 while the RST input is high and willtransition to state 904 when the RST input goes low.

The state machine is designed to enter state 904 when it receives apower on reset input from POR 712 or a low input on the RST output ofTSM 706. The state machine will remain in state 904 as long as the INinput from I/O circuit 710 is high. As will be described later in regardto FIG. 11A, I/O circuit is designed to output a high on the IN signalwhen the state machine outputs a low on the MRST signal and if the DIOinput 308 to I/O circuit 710 is not being externally driven. The high onthe IN signal maintains the state machine 900 in state 904 whichmaintains a low on the state machine MRST output. While MRST is low, SPC306 circuitry and Tap Domains 104 are held in an inactive reset statethat cannot interfere with the normal operation of the target IC.

When the JTAG controller 100 and PSC circuit 302 of FIG. 5A are firstconnected to the DIO signal of the target IC's SPC circuit 306 of FIG.7A, the operation of the PSC and SPC circuits need to be synchronizedsuch that the serialized TMS and TDO patterns from the PSC are correctlyinput as serialized TMS and TDO patterns to the SPC. The states withinsection 916 of the state diagram of FIG. 9B provide one example of howthis required synchronization step may be achieved. A timing diagramdepicting this synchronization process is shown in FIG. 9C.

Time reference 918 of FIG. 9C indicates a time period where the PSC 302is not connected to SPC 306, i.e. DIO 308 is not being externallydriven. The circuitry in the SPC 306 and Tap Domains 104 of the targetIC have been initialized as previously described and the state machine900 is in state 904 polling the high output of the IN signal andoutputting a low on the MRST output. Time 918 could be a time where thetarget IC in which the SPC 306 and Tap Domains 104 reside is operatingnormally in a system and the SPC's DIO signal is not being externallydriven to perform test, emulation, debug, and/or trace operations. Inthis timing example it is assumed that CLK signal 310 is being activelydriven by a clock source within the target IC. Thus state machine 900state 904 is polling the high logic level of the IN signal during eachrising edge of the active CLK signal 310. It is worth noting that if theIN signal were to temporarily go low during a CLK cycle input for someunknown reason, the state machine would return to state 904 via state906. Further, the state machine would return to state 904 from states908 and 910 in response to the IN signal having other temporarily lowand high signal sequences for some unknown reason.

Time reference 920 of FIG. 9C indicates a time period where the PSC 302has been externally connected to the SPC 306 via the DIO 308 and CLK 310signals. During the physical connection process there may be undesirabletemporary signaling sequence on DIO 308 due to the electrical connectionbeing formed between the PSC and SPC. These temporary signal sequencescould prevent the successful synchronization between the PSC and SPC.The state transition mapping in section 916 of FIG. 9B is provided tofilter out the following three types of temporary signal sequences onthe DIO so that they do not affect the synchronization process betweenPSC and SPC.

(1) As seen in the state diagram, a temporary DIO signal sequence of1-0-1 during the connection process would cause the state machine totransition from state 904 to state 906 and back to state 904. Thus thistemporary DIO connection sequence is prevented from affecting thesynchronization process.

(2) As seen in the state diagram, a temporary DIO signal sequence of1-0-0-0-1 during the connection process would cause the state machine totransition from state 904 to state 906 to state 908 and back to state904. Thus this temporary DIO connection sequence is prevented fromaffecting the synchronization process.

(3) As seen in the state diagram, a temporary DIO signal sequence of1-0-0-1-0-1 during the connection process would cause the state machineto transition from state 904 to state 906 to state 908 to state 910 andback to state 904. Thus this temporary DIO connection sequence isprevented from affecting the synchronization process.

It should be understood that while the example state machine has beendesigned to filter out the above three types of temporary DIO sequences,it could be designed to filter out a greater number of DIO sequences ifdesired.

Time reference 922 of FIG. 9C indicates the start of a time period wherethe connection between the PSC 302 and SPC 306 has been made and thestate machine is in state 904 with the IN signal driven high by DIOinput from the connect PSC 302. The PSC 302 begins the synchronizationprocess by serially inputting a pattern of two logic 0's 924 on theSPC's IN signal via DIO 308, which causes the state machine 900 totransition from state 904 to state 906 to state 908. As seen in FIG. 5A,the PSC outputs the two logic 0's by loading the PISO 502 with a TMSvalue of 0 and a TDO value of 0 using the LD signal, then shifting thePISO to output the two logic 0's using the CLK signal 310. Next the PSC302 serially inputs a pattern of two logic 1's 926 on the SPC's INsignal via DIO 308, which causes the state machine 900 to transitionfrom state 908 to state 910 to state 912. Again as seen in FIG. 5A, thePSC outputs the two logic 1's by loading the PISO 502 with a TMS valueof 1 and a TDO value of 1 using the LD signal, then shifting the PISO tooutput the two logic 1's using the CLK signal 310. As seen, the statemachine 900 can only transition from state 904 to state 912 in responseto the exact input of a serial pattern of two logic 0's followed by aserial pattern of two logic 1's.

As seen in the timing diagram, the MRST and CE signal outputs of statemachine 900 are set high in state 912 at time 925. MRST going highremoves the reset condition from Tap Domains 104, TSM 706, and updateregister 704. CE going high causes FF 902 to set CENA high at time 927.When CENA goes high, the CRST signal of controller 700 is set high whichenables the controller 700 to start outputting UCK and TCK signals attime 923. The first UCK signal at time 923 loads the two logic 1's ofpattern 926 into update register 704. The enabling of the SPC'scontroller 700 at time 923 occurs such that the UCK and TCK signals ofthe SPC's controller 700 are synchronized with the LD and CKIN signalsof the PSC's controller 500, respectively. By synchronizing the UCKsignal with the LD signal and the TCK signal with the CKIN signal theSPC 306 can correctly receive subsequent serialized two bit patternsfrom PSC 302 via DIO 308. For example, when the PISO 502 is shifting outa two bit pattern the SIPO 702 is shifting in the two bit pattern, andwhen the PISO 502 is loading the next two bit pattern to be shifted theSIPO 702 is updating the current two bit pattern to the update register704. The synchronized operation of the UCK and LD signals and the TCKand CKIN signals will be seen more clearly in regard to the descriptionof FIG. 14A.

While state machine 900 of the present disclosure has been designed touse a sequence of two serialized two bit patterns 924 and 926 forsynchronization, it could be designed to use a longer sequence ofserialized two bit patterns for synchronization if desired. Using alonger sequence of two bit patterns would further reduce the possibilityof synchronization failure between the PSC and SPC due to the previouslymentioned connection process during time 920. Also a longersynchronization pattern sequence would improve the state machine's 900ability to return to state 904, when DIO is not externally driven, inthe event unexpected signaling were to occur on the state machine's INinput. While the example two bit patterns 924 and 926 used two 0's andtwo 1's respectively, the two bits of a pattern may use any desired ornecessary combinations of 0's and 1's as well. The TMS portion of thelast two bit pattern of a pattern sequence will be the first TMS inputthe Tap Domains 104 and TSM circuit 706 respond to. In the FIG. 9Cexample, the TMS portion of pattern 926 was set to logic 1 to cause theTap Domains 104 and TSM circuit 706 to remain in the TLR state followingsynchronization. If the TMS portion of pattern 926 had been set to logic0, the Tap Domains 104 and TSM circuit 706 would have transitioned tothe RTI state following synchronization.

Following the above described PSC and SPC synchronization process, thePSC may begin inputting serialized TDO and TMS patterns to the SPC toscan JTAG instructions or data into the Tap Domains 104. The followingexample describes the PSC inputting serialized TDO and TMS patterns tothe SPC to cause the Tap Domains 104 to perform an instruction scanoperation according to the Tap state diagram of FIG. 10.

The SPC inputs a first serialized TDO (X) and TMS (0) pattern 928 fromthe PSC which is input to SIPO 702 and applied to the TDI and TMS inputTap Domains 104 and the TMS input of TSM 706 via update register 704during UCK 929. The X in the TDO portion of the pattern indicates thatTDO is a “don't care” signal. This first TDI and TMS pattern input toTap Domains 104 and TSM 706 causes the Tap Domains and TSM to transitionfrom the Test Logic Reset (TLR) state to the Run Test/Idle (RTI) state(FIG. 10) in response to TCK 942. On the falling edge of TCK 942 the TSM706 sets its RST signal high to remove the reset condition at the inputof OR gate 808 of controller 700. In response to RST going high, statemachine 900 transitions to state 914 on the next rising edge of CLK 310.The state machine sets the CE output low in state 914 which causes FF902 to output a low on CENA on the falling edge of CLK 310. Statemachine 900 will remain in state 914 while the RST signal is high.

The SPC inputs a second serialized TDO (X) and TMS (1) pattern 930 fromPSC which is input to SIPO 702 and applied to the TDI and TMS input TapDomains 104 and the TMS input of TSM 706 via update register 704 duringUCK 931. This second TDI and TMS pattern causes the Tap Domains 104 andTSM to transition from the RTI state to the Select-DR (SLD) state inresponse to TCK 944.

The SPC inputs a third serialized TDO (X) and TMS (1) pattern 932 fromPSC which is input to SIPO 702 and applied to the TDI and TMS input TapDomains 104 and the TMS input of TSM 706 via update register 704 duringUCK 933. This third TDI and TMS pattern causes the Tap Domains 104 andTSM to transition from the SLD state to the Select-IR (SLI) state inresponse to TCK 946.

The SPC inputs a fourth serialized TDO (X) and TMS (0) pattern 934 fromPSC which is input to SIPO 702 and applied to the TDI and TMS input TapDomains 104 and the TMS input of TSM 706 via update register 704 duringUCK 935. This fourth TDI and TMS pattern causes the Tap Domains 104 andTSM to transition from the SLI state to the Capture-IR (CPI) state inresponse to TCK 948.

The SPC inputs a fifth serialized TDO (0) and TMS (0) pattern 936 fromPSC which is input to SIPO 702 and applied to the TDI and TMS input TapDomains 104 and the TMS input of TSM 706 via update register 704 duringUCK 937. This fifth TDI and TMS pattern causes the Tap Domains 104 andTSM to transition from the CPI state to the Shift-IR (SHI) state inresponse to TCK 950. When the TSM 706 transitions to the SHI state it'sOE output is set to enable the output drive of I/O circuit 710 such thatthe first TDO output from the Tap Domains 104 can be output on DIO 308to be input to the JTAG controller's TDI input via I/O circuit 504 ofPSC controller 500. TSM 706 sets its OE to enable the output drive ofI/O circuit 710 whenever the TSM (and Tap Domains) is in the Shift-IR orShift-DR states of FIG. 10.

The SPC inputs a sixth serialized TDO (1) and TMS (0) pattern 938 fromPSC which is input to SIPO 702 and applied to the TDI and TMS input TapDomains 104 and the TMS input of TSM 706 via update register 704 duringUCK 939. This sixth TDI and TMS pattern causes the Tap Domains 104 andTSM to remain in the SHI state in response to TCK 952. In pattern 938,TDO is shown set to a 1 to indicate that the first TDI input to beshifted into the Tap Domains 104 is a logic 1.On the rising edge of TCK952 the first TDI input (1) of the sixth pattern 938 is shifted into theTap Domains 104. Also the first TDO output from the TAP Domains 104 isinput to the TDI input of the JTAG controller 100 on the rising edge ofa CKIN input which is synchronized to TCK 952.

For as long as serialized patterns (940, 942, . . . ) are input to causethe Tap Domains 104 (and TMS 706) to remain in the SHI state (i.e. TMSportion of the patterns=0), the TDI input portion of each pattern willbe input to the Tap Domains 104 while TDO outputs from the Tap Domainswill be input to the JTAG controller 100. When the shifting in and outof TDI and TDO is complete, the PSC will input serialized patterns withthe TMS portion of the patterns set to move the Tap Domains 104 and TMS706 from the Shift-IR state (SHI) to the Exit1-IR state, then to anyother state according to the Tap state diagram of FIG. 10.

While the above process described performing an instruction scanoperation between the JTAG controller and Tap Domains of the target IC,data scan operations may be similarly performed. Instruction and datascan operations using serialized TDI and TMS inputs from the JTAGcontroller and TDO outputs from the Tap Domains can be used to performtest, emulation, debug, trace, and/or other operations via the twosignal DIO 308 and CLK 310 interface between the PSC and SPC.

When an operation is complete, the JTAG controller can output a stringof serialized TDO and TMS patterns with the TMS portion of each patternset to a logic one to cause the Tap Domains 104 and the TSM circuit 706to transition into the Test Logic Reset state of FIG. 10. As seen inFIG. 10, the Tap state machine is designed to transition from any of itsstates to the Test Logic Reset state whenever it receives at least 5logic high inputs on TMS. Therefore 5 serialized TDO and TMS patternseach with TMS high will cause the Tap Domains 104 and TSM 706 to enterthe Test Logic Reset state.

When the TSM 706 enters the Test Logic Reset state it will set the RSToutput low which will reset the controller 700 and cause the MRS 708state machine 900 to enter state 904, which will result in the signallevels shown during time reference 918 of the timing diagram of FIG. 9C.After the SPC circuitry has been reset by the RST signal the DIO and CLKconnection between the PSC and SPC can be removed. During the PSC andSPC disconnect step, temporary signal glitching/bounce may occur on theDIO signal. The previously described state machine 900 states in section916 of FIG. 9B come into play once again to filter the IN input to thestate machine such that the state machine remains in or returns to state904 following any undesired temporary DIO signaling that may occurduring the disconnect step. Following the disconnect step, the statemachine will be in state 904 with the MRST output low, which maintains areset condition on controller 700, TSM 706, and Tap Domains 104.

FIG. 11A illustrates an example of a JTAG controller 100 and PSC 302arrangement 1100 interfaced the SPC 306 and Tap Domains 104 of target IC300 via DIO 308 signal connections between I/O circuit 504 ofarrangement 1100 and I/O circuit 710 of the target IC. Forsimplification, the CLK 310 signal that accompanies the DIO signal 308is not shown in this example. Also for simplification and ease ofdescription, the I/O circuits 504 and 710 are shown to exist outside thePSC 302 and SPC 306 respectively, instead of inside as previously shownin FIGS. 5A and 7A. I/O circuit 504 is coupled to the PSC 302 via theOUT signal and to the JTAG controller 100 via the TDI signal. I/Ocircuit 710 is coupled to the Tap Domains 104 via the TDO signal and tothe SPC via the IN and OE signals.

I/O circuit 504 consists of an input circuit 1102, an output buffer1104, and a resistor 1106. The OUT signal is coupled to the input ofbuffer 1104 and to a first input of the input circuit 1102. The outputof the buffer 1104 is coupled to the DIO signal via resistor 1106. TheDIO signal is coupled to a second input of the input circuit 1102. Theoutput of the input circuit 1102 is coupled to the TDI input of the JTAGcontroller 100.

I/O circuit 710 consists of an input circuit 1108, an output buffer1110, a resistor 1112, and a pull up (PU) circuit 1114. The TDO signalis coupled to the input of buffer 1110 and to a first input of the inputcircuit 1108. The output of the buffer 1110 is coupled to the DIO signalvia resistor 1112. The DIO signal is coupled to a second input of theinput circuit 1108 and to the PU circuit 1112. The output of the inputcircuit 1108 is coupled to the IN input of SPC 306.

The PU circuit 1114 is used to set the DIO signal input to input circuit1108 high when the DIO signal is not being driven by either buffer 1104or 1110. For example, when the JTAG controller and PSC arrangement 1100is not connected to the DIO of the target IC and while the output driveof buffer 1110 of the target IC is disabled by the OE signal, the PUcircuit 1114 will set the DIO signal high so that logic ones are inputto the SPC 306 from the IN signal output of input circuit 1108 high. Thehigh on the IN signal will cause the state machine 900 of MRS circuit708 to remain in state 904 of FIG. 9B, as previously described.

The output buffer 1104 of I/O circuit 504 and the output buffer 1110 ofI/O circuit 710 will preferably be designed to have approximately thesame current sink/source drive strength. Also the resistors 1106 and1112 of I/O circuits 504 and 710 will have approximately the sameresistance.

FIG. 11B illustrates timing waveforms for the four cases A-D in whichsimultaneous data communication occurs between the I/O circuits 504 and710 via DIO 308. Each case A-D is indicated in the timing diagram byvertical dotted line boxes. FIG. 12 illustrates the current flow on theDIO signal wire during each of the four cases A-D. In these examples,the OE input to buffer 1110 is set to enable the buffer 1110 to drivethe DIO signal.

Case A shows PSC 302 driving OUT low and Tap Domains 104 driving TDOlow. As seen in Case A of FIG. 12, with lows being output from bothbuffers 1104 and 1110 only a small amount of current flows on the DIOsignal wire. This small current flow does not develop a significantvoltage drop across resistors 1106 and 1112. Thus the DIO signal inputto the input circuits 1102 and 1108 will be easily detectable as being alow signal input. In response to this OUT and TDO output condition theDIO signal is driven low. With OUT and DIO low, the input circuit 1102inputs a low on the TDI input to JTAG controller 100. With TDO and DIOlow, the input circuit 1108 inputs a low on the IN input to SPC 306.

Case B shows PSC 302 driving OUT low and Tap Domains 104 driving TDOhigh. As seen in Case B of FIG. 12, with a low being output from buffer1104 and a high being output from buffer 1110 a larger current flowsbetween the buffers on the DIO signal wire. The resistors 1106 and 1112serve to limit this larger current flow and the voltage drops developedacross them establish mid level voltage on the DIO wire that is easilydetectable by the input circuits 1102 and 1108 from being either high orlow. In response to this OUT and TDO output condition the DIO signal isdriven to a mid voltage level. With OUT low and DIO at a mid voltage,the input circuit 1102 inputs a high on the TDI input to JTAG controller100. With TDO high and DIO at a mid voltage, the input circuit 1108inputs a low on the IN input to SPC 306.

Case C shows PSC 302 driving OUT high and Tap Domains 104 driving TDOlow. As seen in Case C of FIG. 12, with a high being output from buffer1104 and a low being output from buffer 1110 a larger current flowsbetween the buffers on the DIO signal wire. The resistors 1106 and 1112serve to limit this larger current flow and the voltage drops developedacross them establish mid level voltage on the DIO wire that is easilydetectable by the input circuits 1102 and 1108 from being either high orlow. In response to this OUT and TDO output condition the DIO signal isdriven to a mid voltage level. With OUT high and DIO at a mid voltage,the input circuit 1102 inputs a low on the TDI input to JTAG controller100. With TDO low and DIO at a mid voltage, the input circuit 1108inputs a high on the IN input to SPC 306.

Case D shows PSC 302 driving OUT high and Tap Domains 104 driving TDOhigh. As seen in Case D of FIG. 12, with highs being output from bothbuffers 1104 and 1110 only a small amount of current flows on the DIOsignal wire. This small current flow does not develop a significantvoltage drop across resistors 1106 and 1112. Thus the DIO signal inputto the input circuits 1102 and 1108 will be easily detectable as being ahigh signal input. In response to this OUT and TDO output condition theDIO signal is driven high. With OUT and DIO high, the input circuit 1102inputs a high on the TDI input to JTAG controller 100. With TDO and DIOhigh, the input circuit 1108 inputs a high on the IN input to SPC 306.

FIG. 13A illustrates one example of how to design an input circuit 1300that can be used as either an input circuit 1102 or 1108. The inputcircuit 1300 includes a voltage comparator circuit 1302, a multiplexers1304, an inverter 1306, and a buffer 1308. The voltage comparatorcircuit 1302 inputs voltages from DIO and outputs digital controlsignals S0 and S1 to multiplexer 1304. As seen, a first voltage (V) toground (G) leg 1310 of voltage comparator circuit 1302 comprises aseries P-channel transistor and a current source and a second voltage toground leg 1312 comprises a series N-channel transistor and a currentsource. As seen, S1 is connected at a point between the P-channeltransistor and current source of the first leg 1310 and S0 is connectedat a point between the N-channel transistor and current source of thesecond leg 1312. The gates of the transistors are connected to DIO toallow voltages on DIO to turn the transistors on and off.

The operation of the voltage comparator circuit 1302 and multiplexer1304 is shown in the truth table of FIG. 13B and described herein. Ifthe voltage on DIO is low, the S0 and S1 outputs are set high, whichcauses the multiplexer 1304 to select its low input 1314 and output thelow input on the TDI/IN (TDI for circuit 1102 and IN for circuit 1108)signal via buffer 1308. If the voltage on DIO is at a mid level, the S0is set low and the S1 is set high, which causes the multiplexer 1304 toselect its inverted OUT/TDO (OUT for circuit 1102 and TDO for circuit1108) input signal 1316 and output the inverted OUT/TDO signal to theTDI/IN signal via and buffer 1308. If the voltage on DIO is high, the S0and S1 outputs are set low, which causes the multiplexer 1304 to selectits high input 1318 and output the high input to the TDI/IN signal viaand buffer 1308.

From the above description it is clear that the input circuit 1300 will;(1) input a low on TDI/IN if the DIO signal is low, (2) input a high onTDI/IN if the DIO signal is high, and (3) will input the inverse ofOUT/TDO on TDI/IN if the DIO signal is at a mid level voltage betweenhigh and low.

Referring back to FIG. 11A and in reference to the above description ofinput circuit 1300 it is clear that,

(1) If DIO is high, input circuits 1102 and 1108 will input highs to theJTAG controller 100 and SPC 306 respectively.

(2) If DIO is low, input circuits 1102 and 1108 will input lows to theJTAG controller 100 and SPC 306 respectively.

(3) If DIO is mid level and the OUT signal from PSC 302 is low, inputcircuit 1102 will know that the Tap Domain 104 is outputting a high onTDO to cause the mid level on DIO. Input circuit 1102 will thereforeinput a high to the TDI input of JTAG controller 100.

(4) If DIO is mid level and the OUT signal from PSC 302 is high, inputcircuit 1102 will know that the Tap Domain 104 is outputting a low onTDO to cause the mid level on DIO. Input circuit 1102 will thereforeinput a low to the TDI input of JTAG controller 100.

(5) If DIO is mid level and the TDO signal from Tap Domain 104 is low,input circuit 1108 will know that the PSC 302 is outputting a high onOUT to cause the mid level on DIO. Input circuit 1108 will thereforeinput a high to the IN input of SPC 306; and

(6) If DIO is mid level and the TDO signal from Tap Domain 104 is high,input circuit 1108 will know that the PSC 302 is outputting a low on OUTto cause the mid level on DIO. Input circuit 1108 will therefore input alow to the IN input of SPC 306.

FIG. 14A shows a complete arrangement where the JTAG controller 100 andPSC 302 are connected to and are communicating with the SPC 306 and TapDomains 104 of target IC 300 via the DIO 308 and CLK 310 signals. Forsimplification only the circuit elements of the PSC 302 and SPC 306 thatare involved with the communication process are shown. The timingdiagram of FIG. 14B details the communication process.

In the timing diagram of FIG. 14B, both the controllers 500 and 700 ofPSC and SPC, respectively, have been synchronized as previouslydescribed and are actively operating their respective LD and CKIN andUCK and TCK signals in response to the CLK signal 310. As seen andpreviously mentioned, the LD signal of the PSC operates synchronous withthe UCK signal of the SPC, and the CKIN signal of the PSC operatessynchronous with the TCK signal of the SPC. For simplification the CKINand TCK signals are shown as one clock signal.

During LD signal 1402 TMS and TDO pattern N 1404 from JTAG controller100 is loaded into PISO 502. The TMS portion of the loaded pattern isshifted from PISO 502 to SIPO 702 during CLK 1406 and the TDO portion ofthe loaded pattern is shifted from PISO 502 to SIPO 702 during CLK 1408.CKIN 1410 advances the JTAG controller to output the next TMS and TDOpattern N+1 1412 and to input the TDO output 1415 from the Tap Domains(if in the Shift-DR or Shift-IR state). TCK 1410 causes the TAP Domains104 to respond to the previously transmitted TDI and TMS input patternN−1 1414 input to the Tap Domains during UCK 1413. Also during TCK 1410,the Tap Domains will output the next TDO output to be input to the JTAGcontroller (if in the Shift-DR or Shift-IR state).

During LD signal 1418 TMS and TDO pattern N+1 1412 from JTAG controller100 is loaded into PISO 502. The TMS portion of the loaded pattern isshifted from PISO 502 to SIPO 702 during CLK 1420 and the TDO portion ofthe loaded pattern is shifted from PISO 502 to SIPO 702 during CLK 1422.CKIN 1424 advances the JTAG controller to output the next TMS and TDOpattern N+2 1426 and to input the TDO output 1428 from the Tap Domains.TCK 1424 causes the TAP Domains 104 to respond to TDI and TMS inputpattern N 1416 input to the Tap Domains during UCK 1413. Also during TCK1424, the Tap Domains will output the next TDO output 1432 to be inputto the JTAG controller.

The above described timing example of the communication between the JTAGcontroller 100 and Tap Domains 104, via PSC and SPC, continues while aDIO and CLK connection exists between the PSC and SPC and while the CLKsignal 310 is active.

FIG. 14C illustrates a timing example of the arrangement of FIG. 14Aperforming a single data register shift operation between the JTAGcontroller and Tap Domains. As seen the JTAG controller outputs asequence of TMS and TDO patterns 1440-1454 that will control the TapDomains to transition from the Run Test/Idle (RTI) state, to theSelect-DR (SLD) state, to the Capture-DR (CPD) state, to the Select-DR(SLD) state, to the Exit1-DR (X1D) state, to the Update-DR (UPD) state,and back to the RTI state of FIG. 10. This Tap state sequence will causea one bit data register shift operation to occur between the JTAGcontroller and Tap Domains. The sequence of patterns 1440-1454 outputfrom the JTAG controller is serialized by the PSC and de-serialized bythe SPC to be input to the Tap Domains as TDI and TMS pattern sequences1454-1468. As seen the process of serializing and de-serializing thepatterns causes TDI and TMS patterns input to the Tap Domains to lagbehind the TMS and TDO patterns output from the JTAG controller.

If the JTAG controller were conventionally connected to the Tap Domainsas seen in FIG. 1, the TDO to TDI data shift operation between themwould occur on the rising edge of the CKIN and TCK at time 1470, i.e.when the Tap Domains transition from the Shift-DR (SFD) state to theExit1-DR (X1D) state. However due to the pattern lag, the TDO to TDIdata shift operation between them occurs on the rising edge of the CKINand TCK at time 1472. The shift in of the TDO data output from the JTAGcontroller to the TDI input of the Tap Domains is not effected by thepattern lag since the TDO data remains in the TDI and TMS pattern inputto the Tap Domains following the serialization and de-serializationprocess and is clocked into the Tap Domains on the rising edge of TCK1472. However, the JTAG controller will not input the correct TDO outputfrom the Tap Domains on the rising edge of CKIN 1470 since, due to thepattern lag, the correct TDO output (shown as dark filled) from the TapDomains is not output from the Tap Domains until the falling edge of TCK1470. Thus while TDO data from the JTAG controller is correctly input asTDI date to the Tap Domains, the TDO output from the Tap Domains isincorrectly input as TDI data to the JTAG controller.

JTAG controllers that are designed using Texas InstrumentsSN74/54ACT8990 JTAG bus controller chips can resolve the above mentionedpattern lag problem. The SN74/54ACT8990 JTAG bus controller chips weredesigned to operate with cabling between JTAG controllers and target ICsthat can register the TMS and TDO outputs from the JTAG controller tothe TMS and TDI inputs of the target IC.

FIG. 15 illustrates an arrangement whereby the ACT8990 JTAG controllerchip 1502 is interfaced to a target IC 1520 via a cable 1514 thatincludes FFs 1516-1518 in the path between the ACT8990's TMS and TDOoutputs and the target IC's TMS and TDI inputs. In this example thetarget IC sources the CKIN to the ACT8990 and also times the operationof FFs 1516 and 1518. As seen, the FFs 1516 and 1518 cause the TMS andTDI inputs to the target IC to lag the TMS and TDO output from theACT8990 similar to the way the PSC and SPC circuits of FIG. 14A causethe TMS and TDI inputs to IC 300 to lag the TMS and TDO output of theJTAG controller 100 in FIG. 14A.

A simplified block diagram of the ACT 8990 shows it containing a circuit1504 for transmitting the TMS signal, a circuit 1506 for transmittingthe TDO signal, a circuit 1510 from receiving the TDI signal, and acircuit 1508 for delaying the TMS signal 1512 input to the TDI receivercircuit 1510. The TDI receiver circuit responds to the TMS signal 1512,as per the Tap state diagram of FIG. 10, to know when to input the TDIsignal. In this example, all the circuits 1504-1510 are timed by theCKIN input from the TCK output of IC 1520.

If no FFs existed in the cable, i.e. TMS and TDO output of the ACT8990were directly connected to TMS and TDI inputs of the target IC, the TMSdelay circuit would be set to not delay the TMS signal input to the TDIreceiver. In this case the TDI receiver 1510 operates in step with theTap of the target IC 1520 such that TDI receiver 1510 inputs TDI data atthe same time that the Tap of IC 1520 inputs TDI data.

If the FFs existed in the path as shown, the TMS delay circuit is set todelay the operation of the TDI receiver for one CKIN cycle to allow theoperation of the TDI receiver to be synchronized with the operation ofthe Tap of IC 1520. By delaying the operation of the TDI receiver, theTDI receiver is made to operate in step with the delayed operation ofthe Tap of target IC 1520 such that TDI receiver 1510 inputs TDI data atthe same time that the Tap of IC 1520 inputs TDI data.

While the delay circuit 1508 of the ACT8990 JTAG bus controller chip wasoriginally designed to compensate for delays associated with cables, thepresent disclosure utilizes the delay circuit 1508 feature to compensatefor the delay associated with the serialization and de-serializationoperation of the PSC and SPC circuits in FIG. 14A.

For example, if the JTAG controller 100 of FIG. 14A used the ACT8990chip to control the JTAG bus, the delay circuit 1508 of the ACT8990could be set to delay the TDI input from the Tap Domains of IC 300 byone CKIN cycle such that the TDI input is correctly received on therising edge of CKIN 1472, as shown in the timing diagram of FIG. 14C.Thus the previously mentioned lag problem, due to the serialization andde-serialization process of the PSC and SPC circuits, is remedied byusing JTAG controllers 100 that incorporate the ACT8990 JTAG buscontroller chip or other chips/circuits that can similarly delay theinputting of TDI data from the Tap Domains 104 of FIG. 14A.

FIG. 16 illustrates a first system example wherein a JTAG controller 100and PSC 302 arrangement 1602 is coupled to the SPC 306 and Tap Domains104 of a target IC 1604 via DIO 308 and CLK 310 signal wiring. In thisexample a clock source 1606 within arrangement 1602 is used to drive theCLK signal that times the operation of the PSC and SPC circuits. In thisexample the target IC 1604 requires two dedicated pins for the DIO andCLK signals.

FIG. 17 illustrates a second system example wherein a JTAG controller100 and PSC 302 arrangement 1702 is coupled to the SPC 306 and TapDomains 104 of a target IC 1704 via DIO 308 and CLK 310 signal wiring.In this example a clock source 1706 within target IC 1704 is used todrive the CLK signal that times the operation of the PSC and SPCcircuits. In this example the target IC 1704 requires two dedicated pinsfor the DIO and CLK signals.

FIG. 18 illustrates a third system example wherein a JTAG controller 100and PSC 302 arrangement 1702 is coupled to the SPC 306 and Tap Domains104 of a target IC 1802 via a DIO 308 signal wire. In this example anexternal clock source 1804 used to input a functional clock to IC 1802via a functionally required clock input pin. The external clock sourcealso drives the CLK signal of PSC 302. Since the SPC 306 CLK input isconnected to and driven by the IC's functional clock, a dedicated pinfor the CLK signal 310 is not required on IC 1802. In this example thetarget IC 1802 requires only a dedicated pin for the DIO signal.

FIG. 19 illustrates a fourth system example wherein a JTAG controller100 and PSC 302 arrangement 1702 is coupled to the SPC 306 and TapDomains 104 of a target IC 1802 via a DIO 308 signal wire. In thisexample a functional clock is output from IC 1902 to drive the clockinput of a peripheral circuit 1904 via a functionally required clockoutput pin. Internal to the IC 1902, the functional clock is connectedto and drives the CLK input of SPC 306. External of the IC 1902, thefunctional clock is connected to and drives the CLK input of PSC 302.Since the PSC 302 CLK input is connected to the external functionalclock, a dedicated pin for the CLK signal 310 is not required on IC1902. In this example the target IC 1902 requires only a dedicated pinfor the DIO signal.

FIG. 20 illustrates a fifth system example wherein a JTAG controller 100and PSC 302 arrangement 1702 is coupled to the SPC 306 and Tap Domains104 of a target IC 1604 via DIO 308 and CLK 310 signal wiring. In thisexample a clock source 2002 external of both arrangement 1702 and IC1604 is used to drive the CLK signal that times the operation of the PSCand SPC circuits. In this example the target IC 1604 requires twodedicated pins for the DIO and CLK signals.

The above system examples of FIGS. 16-20 have shown various ways tointerface the PSC and SPC circuits together such that at most theinterface requires two dedicated IC pins for DIO and CLK and at leastthe interface only requires one dedicated pin for DIO. Thus the presentdisclosure is seen to require only one or two dedicated pins on thetarget IC.

The following Figures illustrate an alternate version of the presentdisclosure whereby the SPC 302 and PSC 306 circuits do not use I/Ocircuits 504 and 710, respectively.

FIG. 21A illustrates a JTAG controller 100 interfaced to an alternatePSC circuit 2102. The PSC circuit 2102 is identical to the PSC 302 ofFIG. 5A with the exception that the I/O circuit 504 is not used in PSCcircuit 2102. As seen, without the I/O circuit 504 the OUT output fromPISO 502 is directly output from the PSC via output buffer 1104. Also asseen, without the I/O circuit 504 the TDO input goes directly to the TDIinput of the JTAG controller 100 via an input buffer 1308. As seen inFIG. 21B, the operation timing of the alternate PSC 2102 and JTAGcontroller 100 is identical to the FIG. 5B timing operation of the PSC302 and JTAG controller 100 of FIG. 5A.

FIG. 22A illustrates an alternate SPC circuit 2202 interfaced to TapDomains 104 of target IC 2204. The SPC circuit 2202 is identical to theSPC 302 of FIG. 7A with the exception that the I/O circuit 710 is notused in SPC circuit 2202. As seen, without the I/O circuit 710 the OUTinput to SPC 2202 is directly input to the MRS 708 and SIPO 702 circuitsvia a second input buffer 1308. Also as seen, without the I/O circuit710 the TDO output from Tap Domains 104 is directly output from SPC 2202via 3-state buffer 1110. Buffer 2206 is enabled by the OE signal fromTSM 706. The pull up (PU) element 1114 is connected to the IN signal topull the IN signal high when it is not being externally driven forreasons previously mentioned. As seen in FIG. 22B, the operation timingof the alternate SPC 2202 and Tap Domains 104 is identical to the FIG.7B timing operation of the SPC 302 and Tap Domains 104 of FIG. 7A.

FIG. 23A shows a complete arrangement where the JTAG controller 100 andalternate PSC 2102 are connected to and are communicating with thealternate SPC 2202 and Tap Domains 104 of target IC 2302 via the OUT,CLK, and TDO signals. For simplification only the circuit elements ofthe alternate PSC 2102 and SPC 2202 that are involved with thecommunication process are shown. As seen the OUT output from PSC 2102 isdirectly input to the IN input of the SPC 2202 and the TDO output fromTap Domains 104 is directly input to the TDI input of JTAG controller100. As seen in FIG. 23B, the operation timing of the FIG. 23Aarrangement is identical to the FIG. 14B timing operation of the FIG.14A arrangement.

FIG. 24 illustrates the previously described clocking arrangement of theFIG. 16 system. In FIG. 24, alternate PSC 2102 is used instead of PSC302 and alternate SPC 2202 is used instead of SPC 306. As seen, the IC2402 requires three dedicated pins for OUT, TDO, and CLK.

FIG. 25 illustrates the previously described clocking arrangement ofFIG. 17 system. In FIG. 25, alternate PSC 2102 is used instead of PSC302 and alternate SPC 2202 is used instead of SPC 306. As seen, the IC2502 requires three dedicated pins for OUT, TDO, and CLK.

FIG. 26 illustrates the previously described clocking arrangement ofFIG. 18 system. In FIG. 26, alternate PSC 2102 is used instead of PSC302 and alternate SPC 2202 is used instead of SPC 306. As seen, the IC2602 requires two dedicated pins for OUT and TDO.

FIG. 27 illustrates the previously described clocking arrangement ofFIG. 19 system. In FIG. 27, alternate PSC 2102 is used instead of PSC302 and alternate SPC 2202 is used instead of SPC 306. As seen, the IC2702 requires two dedicated pins for OUT and TDO.

FIG. 28 illustrates the previously described clocking arrangement ofFIG. 20 system. In FIG. 28, alternate PSC 2102 is used instead of PSC302 and alternate SPC 2202 is used instead of SPC 306. As seen, the IC2402 requires three dedicated pins for OUT, TDO, and CLK.

The above system examples of FIGS. 24-28 have shown various ways tointerface the alternate PSC 2102 and SPC 2202 circuits together suchthat at most the interface requires three dedicated IC pins for OUT, TDOand CLK, and at least the interface only requires two dedicated pin forOUT and TDO. Thus the alternate version of the present disclosure isseen to require only two or three dedicated pins on the target IC.

In reference to FIGS. 14A, 14B, 14C, 23A, and 23B it is seen that thefrequency of the CKIN and TCK signals is one half the frequency of thesource driving the CLK signal. Therefore the JTAG controller and the TapDomains operate together at one half the frequency of the CLK sources.For example, if the CLK frequency is 100 Mhz, the JTAG operations willoccur at 50 Mhz. Thus the second benefit of the present disclosure,stated in the DESCRIPTION OF THE RELATED ART section, of providing areduced pin interface capable of operating at one half the frequency ofthe standard 5 pin JTAG interface is achieved.

It should be understood that while the SPC 306 and 2202 of the presentdisclosure has been shown as it would be used for accessing Tap Domainswithin ICs, the SPC is not limited to only accessing Tap Domains withinICs. Indeed, as the need may arise, the SPC can be used within embeddedcore circuits of an IC to allow accessing Tap Domains that exists withinthose embedded core circuits. The teaching in the present disclosure ofhow to use an SPC in an IC is sufficiently detailed to enable oneskilled in the art to also use the SPC within an embedded core.

Although the present disclosure has been described in detail, it shouldbe understood that various changes, substitutions, and alterations maybe made without departing from the spirit and scope of the disclosure asdefined by the appended claims.

1. An integrated circuit, comprising: A. test access port circuitryhaving a TDI input lead, a TMS input lead, a TCK input lead, and a TDOoutput lead; and C. controller circuitry having a TMS/TDI input lead, aclock input lead, and a TDO output lead, the controller circuitry beingconnected to the test access port circuitry by a TDI output lead coupledto the TDI input lead, a TMS output lead coupled to the TMS input lead,a TCK output lead coupled to the TCK input lead, and a TDO input leadcoupled to the TDO output lead of the test access port circuitry and tothe TDO output lead of the controller circuitry, the controllercircuitry including: i. serial input parallel output circuitry having aserial input connected to the TMS/TDI input lead, a clock inputconnected with the clock input lead, a TDI output, and a TMS output; ii.a TDI update register having an input connected to the TDI output of theserial input parallel output circuitry and an output connected to theTDI output lead; and iii. a TMS update register having an inputconnected to the TMS output of the serial input parallel outputcircuitry and an output connected to the TMS output lead.
 2. Theintegrated circuit of claim 1 including a clock circuit external of theintegrated circuit connected to the clock input lead.
 3. The integratedcircuit of claim 1 including a clock circuit on the integrated circuitconnected to the clock input lead.
 4. The integrated circuit of claim 1including a clock circuit on the integrated circuit connected to theclock input lead and supplying a functional clock signal to theintegrated circuit.
 5. The integrated circuit of claim 1 including aninput buffer between the TMS/TDI input lead and the serial input of theserial input parallel output circuitry and a pull-up component at theinput of the input buffer.
 6. The integrated circuit of claim 1 in whichthe TMS/TDI input lead, the clock input lead, and the TDO output lead ofthe controller circuitry are accessible from external the integratedcircuit.